| 摘要 |
PURPOSE:To reduce evaluation time, by providing the pad side for signal input and the pad side for signal output of each chip for an oscillation circuit with a chip for RF prober evaluation having a pad for signal input and a pad for signal output. CONSTITUTION:By applying a suitable bias voltage to a chip 9 for an oscillation circuit, a local signal with a desired frequency is generated from a pad 10 for an oscillation circuit output of the chip 9 for an oscillation circuit, and is input to a pad 4 for a local signal input of a mixer chip 1 via a thin film metal 15. At this time, RF evaluation is enabled by bringing pins of an RF prober into contact with each of the pads 13 and 14 arranged on a chip 11 for RF prober evaluation. Accordingly, RF evaluation of the mixer chip 1 in a wafer state is enabled, by a method wherein the mixer chip 1 and the chip 9 for an oscillation circuit are arranged on the same wafer so as to neighbour with each other, and the chip 11 for RF prober evaluation is added with the signal input-output pads 2 and 3 sides of the mixer chip 1. Evaliation time can be reduced, thereby.
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