发明名称 LASER PROCESSING EQUIPMENT
摘要 PURPOSE:To make a quick processing possible in which an optimum light quantity is applied to a part to be processed, by controlling the light quantity of a laser beam in accordance with the diffraction light quantity obtained from the part to be processed. CONSTITUTION:The following are provided; a first laser light source 11, control means 13 and 14 to control the light quantity of a laser beam LA1 radiated from the first laser light source 11, a first optical system 15-18 and 21 to converge the laser beam LA1 into a specified part 12a to be processed, and detection means 25 and 26 to detect the quantity of defraction light LR1 of the laser beam LA1 obtained from the part 12a to be processed and output the detection result DEM to the control means 13 and 14. The light quantity of the laser beam LA1 is controlled in accordance with the quantity of the diffraction light LR1. While the diffraction light LR1 of the laser beam LA1 is applied to the part 12a to be processed and works upon it, the process condition can be precisely detected, so that the light quantity of the laser beam LA1 is controlled according to the detection result. The part 12a to be processed can be irradiated by the laser beam LA1 having an optimum light quantity.
申请公布号 JPS63181351(A) 申请公布日期 1988.07.26
申请号 JP19870013108 申请日期 1987.01.22
申请人 NIKON CORP 发明人 TANIMOTO SHOICHI
分类号 H01S3/10;B23K26/00;G03F7/20;H01L21/3205;H01L21/82;H01L27/10;H01S3/00 主分类号 H01S3/10
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