| 摘要 |
PURPOSE:To eliminate the gap of a cut-off boundary between a semiconductor package and a sag lead, by cutting off the coupling part between the semiconductor package and a lead frame rim with a cutter-blade installed on a stopper and a die. CONSTITUTION:From a package 3 having a lead frame rim 1, the package 3 is cut off in the lead frame rim cut stage in a tie-bar lead cut metal mold, by making the cutter-blades 61 and 71 of a stopper 6 and a die 7 intermesh into the lead frame rim 1. In this case, a sag lead 2 and the lead frame rim 1 are not torn up but sharply cut off by the cutter-blades. Thereby, the internal stress deformation generating in the sag lead 2 can be avoided, generation of a gap between the sag lead 2 and the package 3 is obstructed, and foreign material such as water content can be prevented from penetrating from the outside.
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