发明名称 |
Apparatus for melting a solder by vapor-phase treatment |
摘要 |
Apparatus for melting by vapor-phase treatment a solder applied to an object. The liquid serving for vapor production, which is situated in a vessel, is heated by electrical heating means which are disposed exclusively outside of the vessel and are completely enveloped by a liquid heat-carrying medium. The vessel floor is provided with projections to increase the thermal transfer. A tubing coil is furthermore disposed in the heat-carrying medium for rapid cooling thereof.
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申请公布号 |
US4759710(A) |
申请公布日期 |
1988.07.26 |
申请号 |
US19870023682 |
申请日期 |
1987.03.09 |
申请人 |
W. C. HERAEUS GMBH |
发明人 |
POLACZY, ANDREAS;SIMON, WERNER |
分类号 |
B23K1/015;(IPC1-7):F27D19/00;F26B19/00 |
主分类号 |
B23K1/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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