发明名称 METAL MOLD FOR PLASTIC SEALING OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the displacement of upper and lower cavities from being caused in the direction of a parting plane by a method wherein a positioning plate is laid between a base block and a cavity block and both blocks are integrated by using this plate. CONSTITUTION:An upper cavity block and a lower cavity block 6, 31 and an upper center block and a lower center block 9, 33 are integrated by using each of plates 55, 56. Accordingly, even when an upper surface table and a lower surface table 4, 29 are thermally deformed by the heat of heaters 3, 28 in such a way that they are curved toward the blocks, no gap is produced between the cavity blocks 6, 31 and the center blocks 9, 33. Accordingly, it is possible to prevent the displacement of both cavities 5, 30 from being caused in the direction of a parting plane.
申请公布号 JPS63181438(A) 申请公布日期 1988.07.26
申请号 JP19870014345 申请日期 1987.01.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMADA HIROMICHI
分类号 B29C45/02;B29C45/26;H01L21/56 主分类号 B29C45/02
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