摘要 |
PURPOSE:To slowly and uniformly heat a substrate and electronic parts to a prescribed temperature by carrying the substrate loaded with the electronic components by a conveyor, and blowing circulating heating air in a preheating zone and a soldering zone. CONSTITUTION:Blowers 16 are rotated simultaneously in the same direction by rotating motors 21, 22, and in a preheating zone 3 and a soldering zone 4, air is sucked from each inlet port 25a, 45a, and fed to a heater 19 through a circulating passage 18. Subsequently, the heater 19 is heated by turning on a power source, heated air brought to a heat exchange is blown to a conveyor 2, allowed to flow into the air inlet ports 25a, 45a again, and hot air is allowed to circulate in the direction A. In this state, by operating a motor 9, the conveyor 2 on which a substrate 6 loaded with electronic components 5 is driven in the direction as indicated with an arrow B, preheated successively in a first preheating zone 31 and a second preheating zone 32, thereafter, heated to a prescribed temperature in a soldering zone 4, and by melting cream solder, the electronic components 5 are soldered to the conductive circuit part of the substrate 6, and cooled by a cooling fan 36.
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