| 摘要 |
PURPOSE:To satisfactorily execute a soldering to an object to be soldered, by giving the vibration of a comparatively high frequency to many projection- like jet waves formed by a molten solder jet nozzle, and forming a fine ruggedness wave on its surface. CONSTITUTION:By a porous member 31 formed on the upper end part of a molten solder jet nozzle 14, many projection-like jet waves 33 are formed, and by the many projection-like jet waves 33, soldering is executed to a printed circuit board 18 positioned at the upper side and chip parts 19 loaded on the board. In this case, by driving vibration generating actuators 35, 38, the porous plate 31 is vibrated in the horizontal direction or the vertical direction, and through the porous plate 31, the fine ruggedness wave 41 is formed on the surface of each projection-like jet wave 33. This fine ruggedness wave 41 infiltrates every nook and corner of the chip parts 19 installed to the lower face of the board 18, therefore, by exhausting flux gas, unwetting by its gas is prevented, and also, unwetting by a surface tension is also prevented, and soldering is executed exactly. |
