| 摘要 |
PURPOSE:To minimize damage of wafers even when part of wafers are damaged during carrying by installing a partitioning boards and spatially separating and isolating a wafer housing chamber. CONSTITUTION:Wafer support sections 11 supporting both sides of wafers 3 at every wafer arranged in parallel and housed and partitioning boards inserted among each wafer 3 are set up. A case 1, an upper surface of which is opened, and a cover 2 with a partitioning boards support section 21, which is mounted, covering the upper surface of the case 1 and into which respective partitioning board 12 is inserted, and a wafer hold-down 22 fixing the upper surface sides of several wafer 3 are fitted. According to such structure, the plates 12 are inserted into the support sections 21 by attaching the cover 2 to the opening surface of the case 1, each support section houses one wafer, and a wafer housing chamber 13 is partitioned. Consequently, when wafers are damaged during carrying, the damage of normal wafers by the splinters of the damaged wafers and the contamination of normal wafers can be prevented. |
