发明名称 ADHESIVE COMPOSITION
摘要 PURPOSE:To provide an adhesive compsn. which enables moisture resistance in the joints of circuit to be improved and is suitable for use in preventing electrolytic corrosion in particular and in connecting circuit such as fine circuits, by incorporating an electrically conductive filler, a metal inactivating agent and a coupling agent in an adhesive component. CONSTITUTION:An adhesive compsn. is obtd. by incorporating 0.1-10vol.% electrically conductive filler (e.g., metal such as Ni or carbon), 0.05-5pts.wt. metal inactivating agent [e.g.,3-(N-salicyloyl)amino-1,2,4-triazole] and 0.05-5pts. wt. coupling agent [e.g.,r-(2-aminoethyl)aminopropyltrimethoxysilane] in 100pts. wt. adhesive component (e.g., a mixture of a base such as an ethylene/vinyl acetate copolymer, with a tackifier such as a terpene phenol resin). The compsn. can improve the moisture resistance is the joints of circuits and is suitable for use in preventing electrolytic corrosion in particular and in connecting circuits such as fine circuits.
申请公布号 JPS63178181(A) 申请公布日期 1988.07.22
申请号 JP19870010243 申请日期 1987.01.20
申请人 HITACHI CHEM CO LTD 发明人 TSUKAGOSHI ISAO;YAMAGUCHI YUTAKA;NAKAJIMA ATSUO
分类号 H01B1/20;C09J11/04;C09J11/06 主分类号 H01B1/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利