| 摘要 |
PURPOSE:To carry out safe cleaning with low toxicity by using an org. solvent contg. fluorine or a mixed solvent contg. the org. solvent as the principal component as a rinse and by specifying the viscosity of the rinse during use. CONSTITUTION:When a resist stripping soln. sticking to a wafer for forming a semiconductor is removed with a rinse to clean the wafer, an org. solvent contg. fluorine or a mixed solvent contg. the org. solvent as the principal component is used as the rinse and the viscosity of the rinse during use if regulated to <=1.0cp. The org. solvent is selected among fluorinated aliphat. hydrocarbons and flon having 20-100 deg.C b.p. is preferably used from the viewpoint of work efficiency and rinsing effect. The mixed solvent consists of the org. solvent and <=about 40wt.% one or more kinds of other solvents such as hydrocarbons. A significant rinsing effect can be produced. |
