| 摘要 |
PURPOSE:To use protruding inner lead sections as connecting terminals, to connect separately formed outer lead sections and to eliminate an adverse effect on a sealing body by sealing a semiconductor element, a stage section, the inner lead sections, etc., with a resin by allowing one parts of the inner lead sections to protrude from a resin sealing section. CONSTITUTION:A lead frame 10 for a semiconductor device is machined, a semiconductor element is fixed to a stage section 12, and inner lead sections 14 and the semiconductor element are bonded by wires, and hermetically sealed with a resin 17. The oblique line sections 16 of a rail section 16 for the frame 10 are cut off while a sealing body 18 is constituted to a stage support bar 13. Connecting sections 14a for the sealing body 18 are brought to the state in which they are connected to outer leads 28, and the connecting sections 14a are bent to upper or lower sections or left as they are horizontal. The semiconductor element, the stage section, the inner lead sections, etc., are sealed with the resin so that one parts of the inner lead sections are allowed to protrude from a resin sealing section, the protruding inner lead sections are employed as the connecting sections, and separately shaped outer lead terminals are connected.
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