| 摘要 |
PURPOSE:To position and solder a clip terminal easily, and to improve the reliability of the joining of the clip terminal and a pattern wiring by forming a side notch to the end surface of a substrate with a circuit pattern and shaping a metallic connecting section, to which a pad on both surfaces of the substrate can be connected, into the indentation of the notch. CONSTITUTION:Three substrates are laminated, holding adhesives 6 among the substrates 1 to which inner layer wiring patterns 7 are formed, thus shaping a laminated substrate 11. Pads 2 only in the number of clip terminals 3 are formed to each of the upper surface and lower surface of the substrate 11, and foundations plated with copper in predetermined thickness are shaped onto the surfaces of the pads 2, and formed in parallel along the edges of end surface sections 8. The semicircular indentations of side notches 4 are shaped to the end surface sections 8, and copper plating-solder plating are conducted to the sections of the side notches 4 and connecting sections 5 are formed. The clip terminals 3 are positioned and soldered easily, thus improving the reliability of a circuit element module.
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