| 摘要 |
The conductor ink for use in the mfr. of multi-layer circuits, esp. on porcelain-coated metal subtrates contains by wt. 70-90 (78-82)% Cu powder, 1-15(2-6)% Ba Ca borocilicate glass frit, 0.5-3 (1-2)% Bi oxide, mixed with the Cu or present as a component of the glass, and 6-25(12-15)% organic vehicle. The glass frit pref. contains by wt., 40-55(52)% Ba oxide, 10-15(12)% Ca oxide, 14-25(16)% B trioxide, and 13-23(20)% silica. The organic vehicle pref. contains up to 25% wt. weting agent. The ink has good soldering properties and there is no point of contact reaction with resistors.
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