发明名称 BRIDGE INSPECTION SYSTEM OF FLAT PACKAGE IN MOUNTED PRINTED CIRCUIT BOARD AUTOMATIC INSPECTION APPARATUS
摘要 PURPOSE:To perform inspection avoiding erroneous detection, by a method wherein beam is allowed to irradiate a printed circuit board to be inspected having a flat package mounted thereon and a beam spot is swept in the direction wherein a large number of the leads of the fat package are arranged. CONSTITUTION:Beam B is allowed to irradiate a printed circuit board P to be inspected having a flat package F mounted thereon and a beam spot is swept in the direction wherein a large number of the leads L of the package F are arranged. Whereupon, for example, since sputter beam is generated by the edge E of the first lead L1 of the package F, the position of the beam B when the sputter beam is detected at first is stored. From this position and the pitch between the leads L, the position of the gap between the leads is detected and the irradiation of the leads L with the beam B is prevented and highly reliable inspection avoiding erroneous detection can be performed.
申请公布号 JPS63177071(A) 申请公布日期 1988.07.21
申请号 JP19870009501 申请日期 1987.01.19
申请人 NAGOYA DENKI KOGYO KK 发明人 MURAOKA KENJU;IKEGUCHI MASAHIKO;HIRANO HISASHI
分类号 H01L21/66;G01N21/88;G01N21/956;G01R31/02;H05K3/34 主分类号 H01L21/66
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