发明名称 METHOD FOR EVALUATING ADHESIVE STATE OF FLOOR MATERIAL
摘要 PURPOSE:To miniaturize an apparatus, to shorten a working time and to easily evaluate an adhesive state on the use site, by scanning the surface of a floor material by a tire-shaped ultrasonic probe for allowing an ultrasonic wave to be incident to the floor material under an incident condition generating a plate wave in the case of a coating material alone. CONSTITUTION:When the adhesive state of a steel plate 3 and concrete 2 is perfect, a thin plate-shaped thing is not present since both materials are unified and, even when an ultrasonic wave is allowed to be incident on a floor material 1, no plate is generated. However, when a part of the steel plate 3 is released from the concrete 2, since the steel plate 3 can be considered to be a single thin plate at the release region C, when an ultrasonic wave is allowed to be incident on the floor material from the surface part A toward the end surface B thereof under a specific condition, the plate wave is generated in the steel plate 3 and a reflected echo can be detected from the end surface B. Then, the surface of the floor material 1 is scanned by a tire-shaped ultrasonic probe 5 for allowing an ultrasonic wave to be incident on the floor material 1 under an incident condition wherein the plate wave is generated in the case of the steel plate 3 alone and, when the presence of the reflected echo at the end surface B is detected, the quality of the adhesive state of both materials can be judged.
申请公布号 JPS63177055(A) 申请公布日期 1988.07.21
申请号 JP19870008773 申请日期 1987.01.17
申请人 SUMITOMO METAL IND LTD 发明人 MURAYAMA RIICHI
分类号 G01N29/04 主分类号 G01N29/04
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