| 摘要 |
PURPOSE:To detect non-soldered parts, by a method wherein the scattering beam of the beam spot allowed to irradiate a printed circuit board to be inspected is formed into an image on the beam receiving surface of a beam spot position detection element and the shape of the soldered part of a mounted chip part is detected. CONSTITUTION:Finely converged beam B is scanned to irradiate a printed circuit board P to be inspected and the reflected beam of the beam B from the printed circuit board P is detected to perform the inspection of the printed circuit board P. A condensing lens 1 for condensing the scattering beam of the beam spot of the beam B allowed to irradiate the printed circuit board P and a beam spot position detection element 2 having a beam receiving surface S arranged at a position where the image of the beam spot is formed by said lens 1 are mounted on an inspection apparatus. Then, the beam spot is swept on the line containing the soldered part H of the chip part T mounted on the printed circuit board P and, on the basis of the position data of the image of the beam spot outputted by the beam spot position detection element 2, the shape of the soldered part H of the chip part T mounted on the printed circuit board P is detected to detect non-soldered parts. |
