| 摘要 |
PURPOSE:To obtain the stability of coating area and coating shape and to improve the productivity by surrounding the outer periphery of a predetermined range including a semiconductor chip secured to a substrate with a high melting- point resin frame, attaching a resin plate of a low viscosity at the time of melting to the top, heating the resin to melt it, thereby preventing the resin from extending after the sealing resin is coated. CONSTITUTION:A semiconductor chip 2 is bonded to a predetermined position on a semiconductor device substrate 1, and a predetermined range including the chip 2 is sealed with resin. In such a resin sealing method, the outer periphery of the predetermined range including the chip 2 is surrounded by a resin frame 5 which becomes liquid of relatively high viscosity at the time of melting, a resin plate 6 having a viscosity lower than that of the frame 5 at the time of melting is attached to the top of the frame 5, they are simultaneously heated to be melted to seal the chip 2. Thus, even if the resin is melted at a certain predetermined temperature at the time of heating to become liquid, a protrusion formed by the frame of the high viscosity resin prevents the low viscosity resin from extending to prevent it from flowing over the predetermined coating range to obtain a stable sealing shape.
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