| 摘要 |
PURPOSE:To improve the water resistance of a humidity-sensitive element without exerting effect on the response of said element, by further coating the humidity- sensitive plasma polymerization film covering the surface of a conductive comb-shaped electrode with a plasma polymerization film of a nitrogen-free organosilicon compound or hydrocarbon. CONSTITUTION:The humidity-sensitive plasma polymerization film directly covering the conductive comb-shaped electrode formed on an insulating substrate is further coated with a plasma polymerization film of a nitrogen-free organosilicon compound or hydrocarbon. As the insulating substrate, not only glass, quartz and alumina but also the insulating film formed on a silicon substrate by the surface oxidation thereof are used. The conductive comb-shaped electrode is formed on the insulating substrate by forming a thin film composed of an electrode forming material such as stainless steel on the substrate at first by a sputtering method and subsequently forming a photoresist pattern thereon. As the monomer used in the formation of the humidity- sensitive plasma polymerization film, pref., there are a mixture of a nitrogen-containing organosilicon compound and halogenosilane, a mixture of org. amine or nitrogen- containing heterocyclic compound and halogenated hydrocarbon or halogenosilane or the like.
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