发明名称 METALLIZED BOARD AND MANUFACTURE OF THE SAME
摘要 The present invention is directed to metallized substrates and particularly metallized substrates for use in microwave integrated circuits and a process for producing such substrates. The metallized substrates generally comprise a dielectric substrate (11) on which is formed a pattern such as a conductor line pattern (20,22), the pattern being formed of a conductive metal. The metallization is accomplished by forming one or more adhesion layers (14,12) from a metallo organic composition which is built up with a metal conductor (16,18).
申请公布号 JPS63177496(A) 申请公布日期 1988.07.21
申请号 JP19870224202 申请日期 1987.09.09
申请人 ENGELHARD CORP 发明人 PASUKARIN EICHI GUEN
分类号 B32B15/04;B32B15/08;C03C17/40;C04B41/51;C04B41/88;H01B5/14;H01B13/00;H01L21/48;H01L23/12;H01L23/498;H01P3/08;H05K1/09;H05K3/12;H05K3/24 主分类号 B32B15/04
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