摘要 |
The present invention is directed to metallized substrates and particularly metallized substrates for use in microwave integrated circuits and a process for producing such substrates. The metallized substrates generally comprise a dielectric substrate (11) on which is formed a pattern such as a conductor line pattern (20,22), the pattern being formed of a conductive metal. The metallization is accomplished by forming one or more adhesion layers (14,12) from a metallo organic composition which is built up with a metal conductor (16,18). |