| 摘要 |
PURPOSE:To defoliate carrier tape easily with adhesive tape left, by adhering a carrier tape with less adhesive force to the circuit pattern surface of a semiconductor wafer through a flexible adhesive film with a greater adhesive force. CONSTITUTION:A flexible adhesive film 3 in the condition that it bears a carrier tape 2 on its back, is affixed to the circuit pattern surface of a semiconductor wafer 4. A pressure-sensitive adhesive layer 2b is formed on a supporting base material 2a of the carrier tape 2, while a pressure-sensitive adhesive layer 3b formed on a supporting base material 3a of the adhesive film 3, wherein the adhesive force of the layer 3b shall be greater than that of the layer 2b. The semiconductor wafer 4 is passed through two roller couples 6, and the carrier tape 2 and the adhesive film 3 forming a protective member 1 are put in pressure contact with the pattern surface of the semiconductor wafer 4. When the film 3 passes the downstream roller couple 6, the carrier tape 2 is defoliated and cut into a specified length by a cutter C, and the rear of the wafer 4 is ground. Thereby even wafer having pattern with great unevenness can be well protected. |
