发明名称 RUNNERLESS INJECTION MOLDING EQUIPMENT
摘要 PURPOSE:To reduce a cost and injection pressure remarkably by simplifying constitution, by enabling heating of a gate heating device through heat transfer of heat energy from a runner heating device by forming the gate heating device of an annular material of high heat transfer properties. CONSTITUTION:A heat pipe 6a of a runner heating device 6 is held at a necessary temperature and necessary heat energy is fed also to a gate heating device 11 of a separate member coming into contact with the runner heating device 6. The gate heating device 11 is formed of copper or an metal such as copper/ beryllium or the other material whose heat conduction is favorable. Molten raw material resin is injected through an injection molding device 2 after arrival of the same at a preset temperature of the gate heating device 11. When the inside of a sprue 3 bored within a mold 4 is filled with the molten resin, the inside of a cavity 7 is filled with the resin of predetermined capacity by passing a necessary quantity through a gate 16a of a gate part 12 from a runner part 10 of the sprue 3 by an action of the injection molding device 2. Then after the filled up resin on the inside of the cavity 7 has been solidified after the lapse of a fixed period of time, a molded product is taken out by breaking a movable mold 27.
申请公布号 JPS63176122(A) 申请公布日期 1988.07.20
申请号 JP19870006247 申请日期 1987.01.16
申请人 SANRI KK 发明人 TSUTSUMI SEI
分类号 B29C45/27;B29C45/73 主分类号 B29C45/27
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