发明名称 RUNNERLESS INJECTION MOLDING EQUIPMENT
摘要 PURPOSE:To provide an inexpensive high-precision device through extremely simple constitution, by a method wherein heat energy is stored in a heat accumulation part and a gate part is heated locally by feeding the heat energy to a heating space formed on the gate part by a pressurizing device such as a piston through a heat flow path. CONSTITUTION:As a heat accumulation part 21 and cylindrical hollow chamber have been formed on a manifold 5, air in the said part 21 is heated by a heater 6 of a manifold 5 and the temperature is raised. When molten raw material resin is injected by an injection molding device 2 under that condition, the inside of a cavity 8 is filled with the molten resin of a desired quantity on the inside of a sprue 3 on the inside of a mold 4 through a runner part 11 and gate part 12. At the time of injection operation, when a pressurizing device 24 is actuated, and stroke motion of a piston 22 is developed through a control device 23 such as an air cylinder based in the heated air in the inside of the heat accumulation part 21, the heated air corresponding to a quantity of the stroke arrives at a heated space H of a gate part 12 by passing through a heat flow path 25, the space H is heated, and the raw material resin on the inside of the gate part 12 is molten through heating.
申请公布号 JPS63176123(A) 申请公布日期 1988.07.20
申请号 JP19870006248 申请日期 1987.01.16
申请人 SANRI KK 发明人 TSUTSUMI SEI
分类号 B29C45/26;B29C45/27;B29C45/73 主分类号 B29C45/26
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