| 发明名称 |
Chip package transmissive to ultraviolet light. |
| 摘要 |
<p>The present invention relates to a semiconductor casing which permits transmitting ultraviolet rays to a semiconductor chip within the casing. The semiconductor casing includes the substrate formed by a thin metal plate (11) for mounting the semiconductor chip (14), a ceramic frame (12) fixed to the periphery of the substrate, a ceramic cap (19) which covers the semiconductor chip, is mounted on the ceramic frame and allows transmission of ultraviolet rays, and leads (16) which are sandwiched between the ceramic frame and the ceramic cap to allow the electrical connection of the semiconductor chip.</p> |
| 申请公布号 |
EP0275122(A2) |
申请公布日期 |
1988.07.20 |
| 申请号 |
EP19880100534 |
申请日期 |
1988.01.15 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES LIMITED;NEC CORPORATION |
发明人 |
OKAMOTO, SATORU ITAMI WORKS OF;TERAZI, KAZUFUMI C/O NEC CORPORATION;NISHINO, SEIICHI C/O NEC CORPORATION;BONKOHARA, MANABU C/O NEC CORPORATION |
| 分类号 |
H01L21/8247;G11C16/18;H01L23/02;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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