发明名称 Bilayer lithographic process.
摘要 <p>A method for producing high resolution patterned resist images having excellent etch resistance and superior thermal and dimensional stability comprises the steps of: (a) forming a planarizing layer resistant to silicon uptake on a substrate, (b) providing a positive-working photoresist composition containing -OH or -NH- groups over the planarizing layer, (c) imagewise exposing the resist to activating radiation, (d) developing the exposed resist, (e) contacting the developed resist with a vapor comprising a silicon-containing compound to effect silylation thereof and thereby impart etch resistance, the silicon-containing compound having the structural formula: &lt;CHEM&gt; wherein X&lt;1&gt; and X&lt;2&gt; are individually chloro or &lt;CHEM&gt; wherein R&lt;3&gt; and R&lt;4&gt; are individually H or alkyl; and R&lt;1&gt; and R&lt;2&gt; are individually H or alkyl; and (f) contacting the planarizing layer with an oxygen-containing plasma so as to preferentially remove portions thereof. d</p>
申请公布号 EP0274757(A2) 申请公布日期 1988.07.20
申请号 EP19870119415 申请日期 1987.12.31
申请人 EASTMAN KODAK COMPANY 发明人 MCCOLGIN, WILLIAM CAREY C/O EASTMAN KODAK COMPANY;BRUST, THOMAS BROWNELL C/O EASTMAN KODAK COMPANY;DALY, ROBERT CURTIS C/O EASTMAN KODAK COMPANY;JECH, JOSEPH, JR. C/O EASTMAN KODAK COMPANY;LINDHOLM, ROBERT DERWOOD C/O EASTMAN KODAK COMPANY
分类号 G03F1/00;G03F1/08;G03F7/039;G03F7/09;G03F7/11;G03F7/26;G03F7/40;H01L21/027 主分类号 G03F1/00
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