| 摘要 |
PURPOSE:To prevent the deformation even when external force is added using a thinly formed lead frame by a method wherein a hole to be used for positioning is provided on the protruded part extended from an element-placing part, and the protruded part is supported by light-transmitting resin at least in two directions. CONSTITUTION:An optical semiconductor element 11 is placed on the element placing part of a lead frame having the protruded part 2 extended from an element placing part 10, and after the optical semiconductor element 11 and the lead frame have been connected by a metal fine wire, a package 6 is constituted by sealing with epoxy resin which is light transmitting one. Then, a hole 3 to be used for positioning is provided almost in the center part of the protruded part 2 of the lead frame, and the protruded part 2 is supported by light-transmitting resin from three directions. Pertaining to the method of retention of the protruded part, an arm 5 is protruded from the protruded part 2, an anchor 4 is provided thereon, and the arm 5 and the anchor 4 are embedded in epoxy resin. As a result, the deformation of the lead frame protruded part generating by the force coming from the external part can be prevented, and the reliability of the machine on which an optical semiconductor device is mounted can also be enhanced.
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