| 摘要 |
PURPOSE:To eliminate contamination, damage, transpiration of flux due to solder reflowing by covering the wire bonding lead region of a printed substrate with a protecting film, then solder plating, cleaning the substrate, and separating the film immediately before an IC is bonded. CONSTITUTION:A section except the wire bonding lead region 4' of a printed substrate 2 is plated with resist 8, a wire bonding lead 4 is placed with gold 9, and the plated resist 8 is then separated. Then, the region 4' is covered with a protecting film 11, the chip component terminal 6 of the substrate 2 is plated with solder 7, chip components 10 are placed, and the film 11 is then separated. It is die bonded to the IC printed substrate 2, and bonded to the wire bonding lead 4. Thus, damage, contamination, etc., of the lead region are eliminated to perform a preferable wire bonding.
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