| 摘要 |
PURPOSE:To improve the moisture resistance of an integrated circuit device by forming in advance a resistor which equalizes resin flowing resistance to an element mounting surface on the opposite surface to the element mounting surface of a metal substrate, and then sealing with resin the whole by transfer molding, thereby eliminating air bubbles in the resin. CONSTITUTION:Resin 39 fluidized in a pot is filled through a main rubber 33, a branch runner 34 and a gate 35 in cavities 36, and a resistor 40 is formed on the opposite surface to the element mounting surface of a metal substrate 38' formed on a lead frame 38. Then, excess curable resin except the resistor 40 is removed, an element 37 is mounted in the cavity 36, the frame 38 is placed with the element mounting surface disposed at downside, and the whole of the substrate 38', the element 37' the resistor 40, and lead ends is sealed. The resistor 40 is so determined in size and shape that the speeds of the resins flowing in the cavities 38 become equal at the upper and lower sections of the frame 38. Thus, the resin flowing resistances of the upper and lower sections of the frame in the cavity can be equalized to improve the moisture resistance without air bubbles in the resin.
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