| 摘要 |
PURPOSE:To accurately position upper and lower metal molds even in a long frame by roughly positioning the lower metal mold by roughly positioning pin provided at the lower mold, then releasing the rough positioning by means of a protrusion formed on the upper mold when the upper mold moves down, and simultaneously positioning the upper mold by accurately positioning pin of the upper mold. CONSTITUTION:A frame 6 in which a semiconductor element is placed is roughly positioned to a lower metal mold 1b by inserting a roughly positioning pin 10 to a positioning hole. An accurately positioning pin 11 has a tapered part for correcting the position at the end to accurately position the position of the frame 6 as the upper metal mold 1a moves down. In this case, the pin 10 of the mold 1b is gradually sunk by a protrusion formed on the mold 11a to release its positioning function. Thus, the frame 6 is effectively positioned fixedly by the pin 11 of the mold 1a. Since the frame 6 is heated at the time of roughly positioning, the preliminary heater of the frame is eliminated. Thus, a correction for an accurate position can be performed even in case of a long frame. |
