发明名称 Apparatus for solder removal
摘要 A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.
申请公布号 US4757780(A) 申请公布日期 1988.07.19
申请号 US19860865232 申请日期 1986.05.20
申请人 THE HTC CORPORATION 发明人 SPIGARELLI, DONALD J.;PECK, DOUGLAS J.;HALL, WALTER J.;FINNEY, JAMES L.
分类号 B23K1/015;B23K1/018;B23K1/08;H05K3/34;(IPC1-7):H05K3/24;B05C3/10 主分类号 B23K1/015
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