| 摘要 |
PURPOSE:To reduce the manufacturing cost of a resin-sealed semiconductor device by forming a remaining part not covered with a semiconductor chip in a resin coating of thermoplastic resin to reduce wasteful resin. CONSTITUTION:First external leads 4a are supported by a mold 16, a support 2 of opposite side to its leading side is supported, thermoset resin of fluidized state is pressed by pressure in the mold to be solidified to form a section 11a covered with the semiconductor chip 7 of a resin coating 11. The remaining section 11a not covered with the chip 7 of the coating 11 is formed by pouring thermoplastic resin in the molding cavity of the same as or another mold from the mold 16. Even if the thermoplastic resin remains in the mold, it is placed in the heating state of the level allowed in resin sealing to be used as next sealing resin, thereby eliminating wasteful resin. |
