| 摘要 |
PURPOSE:To treat a semiconductor wafer uniformly and with no adhesion of dusts by fixing the semiconductor wafer on a slope having a gradient, and causing a liquid to flow along the upper surface of the slope from the top of the slope. CONSTITUTION:The surface of a semiconductor wafer 4 is chemically treated continuously with more than two kinds of liquids. At that time, the wafer 4 is fixed on the upper surface of a slope 1 having a proper gradient. From the top of the slope 1, a liquid 5 is made to continuously flow on the upper surface of the wafer 4 along the slope 1 upper surface. The pouring of the liquid 5 is conducted by gradually putting a necessary amount of liquid B into a liquid reservoir 2 when the water level of a liquid A is approaching the neighborhood of a nozzle 3. With this, the wafer 4 is treated uniformly and with no adhesion of dusts.
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