发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To reduce the width of peripheral metallic interconnection, by separating the interconnection by a section between output elements. CONSTITUTION:Peripheral metallic interconnection 1 is separated by a section between a point to which an outputting MIS transistor 3a is connected and a point to which another outputting MIS 3b is connected. In this manner, even if the outputting element 3a and 3b connected to the interconnection are deviated from each other with respect to the axis of symmetry 5 passing the center of a pad 2 of the metallic interconnection 1, any part of the interconnection will not be supplied with more current and current 8 is equal to current 9. Accordingly, the width 14 of the metallic interconnection can be minimized and thus the area of an integrated circuit can be reduced.
申请公布号 JPS63174334(A) 申请公布日期 1988.07.18
申请号 JP19870006442 申请日期 1987.01.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 AOKI AKIHIDE
分类号 H01L21/3205;H01L23/52 主分类号 H01L21/3205
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