| 摘要 |
PURPOSE:To simplify the structure of the cold system by employing a leaf spring having a height smaller than the minimum lateral dimension in the chip connecting structure, thereby allowing a chip to independently move upward within a limit while maintaining an electrical connection. CONSTITUTION:A chip 5 having a plurality of connecting points is electrically connected to a substrate 3. At that time, a leaf spring 1 having a height smaller than the minimum lateral dimension is inserted into part of the connecting structure. A terminal la for chip is connected to a chip electrode 5 by a solder 4, and a terminal 1b for wiring substrate is connected to a wiring substrate electrode 6 by welding or integration processing. Whereupon, it is enabled to independently move the chip 5 upward within a limit while maintaining the electrical connection. With this, the chip 5 is enabled to be thermally connected to a cooling body 7 independently, whereby the structure of the cold system is extremely simplified.
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