| 摘要 |
PURPOSE:To prevent a suspension lead for holding a die pad from springing back after it is folded, by providing notch grooves at folds of the lead such that the grooves extend along width of the lead. CONSTITUTION:A metal frame having die pads 1 and leads 4 is formed by punching a rectangular metal piece. A notch groove 11 is formed at a fold 2a of a suspension lead 2 such that the groove extends along the width of the lead 2. The suspension lead 2 is folded at the notch groove 11 so that the face 1a of the die pad 1 on which a chip is to be bonded is positioned at a lower level than the wire connecting face 4a. Thereby, the suspension lead can be prevented from springing back after it is folded. Accordingly, the chip bonding face of the die pad can be positioned reliably at a predetermined position.
|
