| 摘要 |
PURPOSE:To prevent the effect of solder bonded to a capacitor electrode flowing to a vibrating electrode by applying a solder resist agent between the capacitor electrode and the vibration electrode connected to the capacitor electrode. CONSTITUTION:Solder resist agents 31, 32 are printed and coated respectively between the capacitor electrode 3 and the vibration electrode 9 and between the capacitor electrode 3 and the vibration electrode 6. A lead terminal 20 is soldered to the capacitor electrode 3 by solder S, lots of solder is bonded to the capacitor electrode 3 in this case to prevent the piezoelectric vibration. Moreover, lead terminals 21, 22 are soldered to electrodes 11, 12 by solder S. In soldering the components above onto a circuit board or the like by the reflow system, even if the solder bonded to the capacitor electrode 3 is molten, the solder is blocked by the solder resist agents 31, 32 and does not flow in excess of them and no effect is given onto the vibration electrodes 6, 9.
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