| 摘要 |
PURPOSE:To obtain the title resin having low thermal expansibility, high heat resistance and excellent high-frequency electrical characteristic and being suited for laminates for printed wiring boards, etc., by heat-curing a specified butadiene polymer and a specified vinyl compound in the presence of an organic peroxide. CONSTITUTION:A low dielectric constant resin obtained by heat-curing 100pts.wt. butadiene polymer containing 50mol.% or above, based on the polymer chain, 1,2-butadiene units having double bonds in the side chains (especially, one containing at least 90mol.%, based on the polymer chain, 1,2-butadiene bonds, having a number-average MW of 50,000-200,000 and an m.p. of 50-200 deg.C and being thermoplastic is desirable) and 10-100pts.wt. vinyl compound having at least three vinyl groups in the molecule (e.g., trihydroxyethylisocyanurate trimethacrylate) in the presence of an organic peroxide. This resin has excellent heat resistance, a low coefficient of thermal expansion and excellent high-frequency electrical characteristic and is suited for laminates for printed wiring boards, etc.
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