| 摘要 |
PURPOSE:To obtain the title composition excellent in heat shock resistance during immersion in solder and moisture resistance after heat shock, by mixing an epoxy resin with a cure accelerator and a highly water-absorptive resin surface-coated with a thermoplastic resin. CONSTITUTION:A highly water-absorptive resin (a) of a starch, cellosic or synthetic polymer type (e.g., acrylic polymer) is coated with a thermoplastic resin (e.g., PP) (b) of a melting temperature of 80-250 deg.C to obtain component (a) surface-coated with component (b) (c) having a diameter <=100mum. An epoxy resin (A) is mixed with a cure accelerator (B) such as an imidazole, a tert. amine, an organophosphorus compound or an organoaluminum compound, 0.5-10 pts.wt. component C and, optionally, a curing agent, a filler, a flame retardant, a treating agent, a pigment, a mold release, etc.
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