| 摘要 |
The process consists of (a) preparing a suitable mould from polyamide dielectric material, treated on its internal surfaces with a suitable mould release agent; (b) placing a mixt. of cork granules and agglutinant in the mould; and (c) subjecting the mould to microwave radiation from suitable sources for sufficient time to bake the core and surface of the mixt. equally.
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