| 摘要 |
PURPOSE:To improve the flame resistance of a solder mask without reducing the heat or thermal shock resistance during soldering by adding red phosphorus powder as a flame retardant to a photosensitive resin compsn. CONSTITUTION:This photosensitive resin compsn. contains 100pts.wt. linear high molecular compd. (A), 50-250pts.wt. photopolymerizable unsatd. compd. (B) having two or more terminal ethylene groups, 2-30pts.wt. sensitizer (system) (C) which initiates the polymn. of the component B on being irradiated with active rays of light and 2-50pts.wt. red phosphorus powder (D). The surface of the component D is preferably coated with a thermosetting resin such as phenol resin from the viewpoint of the dispersibility of the compsn. and the electrical characteristics of a resist. A vinyl copolymer may be used as the component A, a urethane compd. as the component B and benzophenone as the component C. A thermopolymn. inhibitor, a dye, a pigment and an appliability improver may be added to the compsn. |
