| 摘要 |
PURPOSE:To perform an electric characteristic test of a whole wafer irrespective of the size of the wafer or a chuck by providing a stylus position control base between means for bending upward the end of a substrate or a card substrate and a contact stylus, and disposing the lowermost face of a cable connector substantially above the wafer face. CONSTITUTION:A probe card substrate 1 has at its end a contact 2 with a cable, and forms at its center a hole for placing a testing contact stylus 3 and a stylus substrate 4. Then the substrate 1 is bent upward so that a wafer 5 or a chuck 6 may not come in contact with the lowermost face of a cable connector 7. A stylus position control base 8 is inserted between the substrate 1 and the stylus 3, and the stylus position can be corrected downward. Thus, the electric characteristic test of a semiconductor integrated circuit wafer can be performed as to the whole wafer irrespective of the size of the wafer or a chuck.
|
