| 摘要 |
PURPOSE:To reduce the deformation of leads before a substrate is mounted, and to minimize defective soldering, etc. at the time of mounting by fixing at least two or more of the leads lead out to the outside from a package body through a sheet metal having insulating properties. CONSTITUTION:A large number of outer leading-out leads 1 are lead out to the outside from the four side surfaces of a package body 2, and bent to a Z-shape. Sheet metals 3 having electrical insulating properties such as polyimide, glass epoxy, etc. are crossed on each Z-shaped vertical sections, and bonded through a binder. Accordingly, the fixed value of initially determined pitches, etc. is kept as the intervals of respective lead, and the leads are not deformed on an electrical test during a manufacturing process and during carrying, thus resulting in no trouble such as defective contacts even at the time of mounting to a circuit substrate.
|
