| 摘要 |
PURPOSE:To equalize an etching rate on the surface of a wafer by dividing a region holding one wafer in a wafer holder body section into at least two blocks and independently annexing temperature controllers to said each block. CONSTITUTION:A wafer holder body section is divided into three blocks of a circular central block 1a, an annular intermediate block 1b on the outside of the block 1a and an external block 1c on the outside of the block 1b by double concentric circles. Temperature controllers 3 are arranged in parallel with each of the central block 1a, the intermediate block 1b and the external block 1c, a heat exchange agent is circulated through respective block through circulating pipes 2, and the temperatures of each block are controlled independently. Accordingly, the nonuniformity of speed in a wafer surface based on electrode structure is absorbed by temperature difference among the blocks, thus equalizing at etching rate in the wafer surface.
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