发明名称 MANUFACTURE OF INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To eliminate the need for tie-bar cut-off work in a postprocess, and to prevent the generation of a burr completely by crushing first and second resin films, hermetically sealing clearances among leads and sealing the surfaces between the crushed first and second resin films with a sealing medium. CONSTITUTION:Leads 3 for a lead frame 2 are worked, and a resin film 1 is stuck. The resin film 1 pasted to the leads 3 is held by molds 4 from both surfaces and crushed, thus completely sealing both the upper and lower surfaces and clearances of the leads 3. The resin film 1 fills the role of a tie bar at that time. A sealing medium 5 is flowed in. Accordingly, a sealed product on which no flash is generated is acquired.
申请公布号 JPS63169750(A) 申请公布日期 1988.07.13
申请号 JP19870002253 申请日期 1987.01.07
申请人 NEC YAMAGATA LTD 发明人 KITAMURA NAOHIRO
分类号 H01L23/50 主分类号 H01L23/50
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