| 摘要 |
PURPOSE:To reduce the dispersion of the thickness of a photosensitive resin film on the surface of a semiconductor substrate by dropping a proper quantity of a photosensitive resin liquid from one nozzle while atomizing a solvent different from the photosensitive resin liquid from the other nozzle. CONSTITUTION:A semiconductor substrate 1 is sucked onto a base under a vacuum, a solvent 10 is atomized from a nozzle 5 capable of atomizing the solvent, the inside of a device is brought to a humid state, and a proper quantity of a photosensitive resin liquid 11 is dropped from a nozzle 4. The photosensitive resin liquid 11 is applied thinly onto the surface of the substrate 1 by revolution 12 at high speed. electric dampers 13, 14 arranged into an exhaust port 7 and a discharge port 8 are opened at that time, and the atomized solvent 10 and the photosensitive resin liquid 11 dropped in a proper quantity are exhausted or discharged. Accordingly, the nonuniformity of film thickness generated by drying the photosensitive resin liquid 11 is reduced.
|
