| 摘要 |
PURPOSE:To prevent a defect in contacting from being caused by pressing and widening the contact surface of a semiconductor socket outward by a spring and bringing in into surface contact with the lead of a semiconductor. CONSTITUTION:A tip part 21 provided to the main body 4 of the semiconductor socket is formed in an inverted U-shape which slants almost at the tile angle of the lead 11 of the semiconductor 1. Further, the spring 3 is provided inside the tip part 21 and the contacting surface 22 for the lead 21 is pressed and widened outward. Therefore, when the semiconductor 1 is inserted with the lead 11 up, the lead 11 and contacting surface 22 come into surface contact with each other and the contacting pressure between the lead 11 and contacting surface 22 are held high by the pressing force of the spring 3, so the defect in contacting is prevented from being caused.
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