发明名称 DIP SOCKET FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the efficiency of a test by providing 2nd contact arrays which pair with a 1st contact array and have specific intervals with the 1st contact array respectively. CONSTITUTION:The 1st contact array 11 consisting of a contact part 3 provided to a mold main body and contact arrays 12-13 which pair with the array 11 and have the specific intervals with the array 11 are provided. Then the interval D1 between the arrays 11 and 12, the interval between the arrays 11 and 13, and the interval D3 between the arrays 11 and 14 are set to values corresponding to the lead intervals of a semiconductor device to be measured, and consequently suitable contact arrays can be selected according to the semiconductor device, so that test efficiency is improved.
申请公布号 JPS63169575(A) 申请公布日期 1988.07.13
申请号 JP19870002250 申请日期 1987.01.07
申请人 NEC YAMAGATA LTD 发明人 SHIDA KOTARO
分类号 G01R31/26;H01L21/66;H01L23/32;H01R33/76 主分类号 G01R31/26
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