| 摘要 |
PURPOSE:To obtain a heat pipe having good heat conductivity and high rigidity, by a method wherein the outer pipe of the heat pipe is constituted of a silver- copper alloy. CONSTITUTION:An outer pipe 1 is provided with a slender cylindrical configuration and is constituted of the silver-copper alloy of 92.5% of silver and 7.5% of copper. Both ends of the outer pipe 1 are closed to seal the pipe and a minute body 2 to be cooled, such as the integrated circuit of IC, LSI, VLSI or the like, for example, is attached to one end thereof. Said silver-copper alloy, constituting the outer pipe 1, has a high heat conductivity in the same degree as silver or copper and, further, the maximum load to bend the outer pipe is about two times that in the case wherein the outer pipe is formed by copper, therefore, the rigidity of the outer pipe 1 is very high.
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