| 摘要 |
PURPOSE:To improve the adhesion and soft flexibility of a release layer at the time of storage and the plastic cutting and releasability of the same layer at the time of hotstamping by formulating a specific resin composition of cellulose acetate and a plasticizer, a low boiling- point organic solvent and intermediate, high boiling-point organic solvents at a specific ratio. CONSTITUTION:A comparatively large amount of low-boiling point organic solvent and a comparatively small amount of intermediate, high boiling-point organic solvents are formulated with a resin composition of 5-30 weight parts of plasticizer based on 100 weight parts of cellulose diacetate having a degree of substitution of 2.2-2.6 to obtain a dope for formation of a release layer. The low boiling-point solvent includes a solvent whose boiling point is below the temperature level of 70 deg.C or lower, and acetone, acetone/methanol, etc., are used. On the other hand, the intermediate/high boiling-point solvents represent solvents whose boiling point is above the temperature level of 70 deg.C or higher, and methylethylketone, cellosolve, etc., are used. If the low boiling-point solvent is used as a main solvent (65-80 weight parts based on the weight of dope), and then the intermediate/high boiling-point solvents are formulated to the former at a ratio of 5-30 weight % based on the weight of dope, then brushing does not occur easily on a running film. If the concentration of the resin composition in the dope is set to 5-15 weight %, the viscosity decreases advantageously. |
