| 摘要 |
PURPOSE:To permit stable supply of a soldering paste to a micropattern by forming a suspended metal-type screen with only a single piece of metal plate, and forming a through hole pattern to a depth almost half the thickness of a plate from one side of the pattern part, and a mesh-like structure to a depth almost half the remainder of the thickness of the plate from the other side. CONSTITUTION:A through hole pattern 6 is formed to a depth almost half the thickness of a plate from a lower surface (surface of a side contacting a circuit substrate), for example, on a screen made of a 0.2-0.5mm thick steel plate and a mesh-like pattern 7 to a depth almost half the remainder of the thickness of the plate from a top surface (on this surface, a soldering paste is placed, and it is squeezed out by scrubbing with a squeezee), by applying a photosensitive emulsifier on the surface of a copper plate as a mask respectively. After this, the masks are etched. Further, when a metal part 8 is left in a column form in the through hole pattern 6', the pattern 6' is not deformed, even if the pressure of the squeezee 9 is applied at the time of printing. Subsequently, the soldering paste can be supplied to a solder land 11 on the circuit substrate 10, and even fine parts of a pattern can be printed with high precision. |
