发明名称 Semiconductor memory device and method of manufacturing the same.
摘要 <p>In a semiconductor memory device having a floating gate structure, the floating gate electrode (30) is composed of 2 to 10 silicon grains. With the floating gate electrode, the insulation film (31), formed on the floating gate electrode, can have a high breakdown voltage. In a method of manufacturing a semiconductor memory device having a floating gate structure, an insulation film (23) is formed on the silicon substrate (21), portions of the insulation film which are on the drain and source forming regions of the silicon substrate are removed, and a silicon layer (24a) is formed on the silicon substrate (21) by an epitaxial growth process, constituting a floating gate, composed of 2 to 10 silicon grains. According to the manufacturing method, the insulation film (31) formed on the floating gate electrode can have a high breakdown voltage.</p>
申请公布号 EP0274390(A2) 申请公布日期 1988.07.13
申请号 EP19880100116 申请日期 1988.01.07
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MIKATA, YUUICHI C/O PATENT DIVISION;USAMI, TOSHIRO C/O PATENT DIVISION
分类号 H01L21/8247;H01L21/28;H01L29/788;H01L29/792;(IPC1-7):H01L29/78;G11C17/00 主分类号 H01L21/8247
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